Offer summary
Qualifications:
BSEE or equivalent experience, Minimum of 8+ years in board/system design, Package design experience preferred, Understanding of transmission line theory and power delivery, Strong programming skills in Perl, Python, Tcl.Key responsabilities:
- Define chip pad ring and substrate interconnect scheme
- Lead the package layout design process
- Work with teams on chip floor plan and electrical package
- Communicate effectively with various teams