Offer summary
Qualifications:
15+ years experience with BSEE or 10+ years with MSEE, Experience in semiconductor packaging field, Worked on QFN, BGA, CSP packaging types, Proficient with Allegro Package Designer and Virtuoso, Experience in SIP and module designs.
Key responsabilities:
- Design and develop packages for wireless devices
- Collaborate with multi-functional teams for packaging requirements
- Work with foundry and OSAT on packaging solutions
- Involved in package design, implementation, and testing